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YCS M.Y M1 M2 M3 M4 Reballing Stencil Platform for MacBook Repair

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YCS M.Y M1 M2 M3 M4 Reballing Stencil Platform for MacBook Repair

YCS M.Y M1 M2 M3 M4 Reballing Stencil Platform for MacBook Repair

YCS Mr. Yang M.Y M1 M2 M3 M4 Reballing Stencil Platform Kit for MacBook CPU WIFI BGA IC Soldering and Repair. YCS M.Y magnetic rebaliing platform with steel mesh for MacBook A1706, M1, M2, M3, M4 series IC repair. Its magnetic properties effectively fix and stabilize the chip, ensuring precise soldering operations.

Option:
YCS M.Y A706 stencil 0.12mm.
YCS M.Y M1 stencil 0.15mm.
YCS M.Y M2 stencil 0.15mm.
YCS M.Y M3 stencil 0.15mm.
YCS M.Y M4 stencil 0.15mm.
M.Y M1, M2, M3, M4, A1706 positioning mold.
YCS M.Y magnetic base. 


Features:
1. Magnetic Reinforcement Design: The magnetic platform stabilizes the chip position, providing higher operational precision.
2. High-Strength Steel Mesh: Utilizes a high-temperature resistant steel mesh, enhancing the platform's durability and stability.
3. Multiple Specifications: Offers various models and configurations to meet different equipment needs and repair scenarios.
4. Wide Applicability: Suitable for BGA chip repair of MacBook series products and other electronic equipment.

Select Option
From $0.70

Original: $1.99

-65%
YCS M.Y M1 M2 M3 M4 Reballing Stencil Platform for MacBook Repair—

$1.99

$0.70

Product Information

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Description

YCS Mr. Yang M.Y M1 M2 M3 M4 Reballing Stencil Platform Kit for MacBook CPU WIFI BGA IC Soldering and Repair. YCS M.Y magnetic rebaliing platform with steel mesh for MacBook A1706, M1, M2, M3, M4 series IC repair. Its magnetic properties effectively fix and stabilize the chip, ensuring precise soldering operations.

Option:
YCS M.Y A706 stencil 0.12mm.
YCS M.Y M1 stencil 0.15mm.
YCS M.Y M2 stencil 0.15mm.
YCS M.Y M3 stencil 0.15mm.
YCS M.Y M4 stencil 0.15mm.
M.Y M1, M2, M3, M4, A1706 positioning mold.
YCS M.Y magnetic base. 


Features:
1. Magnetic Reinforcement Design: The magnetic platform stabilizes the chip position, providing higher operational precision.
2. High-Strength Steel Mesh: Utilizes a high-temperature resistant steel mesh, enhancing the platform's durability and stability.
3. Multiple Specifications: Offers various models and configurations to meet different equipment needs and repair scenarios.
4. Wide Applicability: Suitable for BGA chip repair of MacBook series products and other electronic equipment.