🚚 Free Worldwide Shipping on All Orders!Shop Now
HomeStore

WL Universal BGA Reballing Stencil Positioning Mold for iPhone

Product image 1

WL Universal BGA Reballing Stencil Positioning Mold for iPhone

WL Universal BGA Reballing Stencil Positioning Mold for iPhone

WL High-Quality Universal Repair Holder for CPU NAND Baseband Tin Plate Steel Net BGA Reballing Stencil Positioning Mold with Fixed Plate.

Description:
  • WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
  • Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
  • Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
  • Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10

Package included:
  • 1pc x Holder
$2.45

Original: $6.99

-65%
WL Universal BGA Reballing Stencil Positioning Mold for iPhone—

$6.99

$2.45

Product Information

Shipping & Returns

Description

WL High-Quality Universal Repair Holder for CPU NAND Baseband Tin Plate Steel Net BGA Reballing Stencil Positioning Mold with Fixed Plate.

Description:
  • WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
  • Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
  • Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
  • Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10

Package included:
  • 1pc x Holder