AMAOE iPhone 12-17 Pro Max Middle Layer Steel Mesh Positioning Mold
Amaoe middle layer reballing stencil with positioning mold for iPhone 12/13/14/15/16/17 Pro Max motherboard mid-frame soldering repair. AMAOE iPhone 12-17 Pro Max motherboard middle layer positioning mold with 0.12mm tin planting mesh net.
Option:
1. 0.12mm middle layer steel mesh for iPhone 12/13/14/15/16/17 series.
2. Positioning mold with 0.12mm middle layer stencil for iPhone 12/13/14/15/16/17 series.
Note: Note: Not including the magnetic base. If you need a full set of iPhone middle layer reballing platforms, please go to SKU: XZ2233.
Features:
1. For iPhone 12/12mini/12 Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/16e/17/Air/17 Pro/17 Pro Max motherboard middle layer tin planting. Precise positioning, fast tin planting.
2. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
AMAOE iPhone 12-17 Pro Max Middle Layer Steel Mesh Positioning Mold
AMAOE iPhone 12-17 Pro Max Middle Layer Steel Mesh Positioning Mold
Amaoe middle layer reballing stencil with positioning mold for iPhone 12/13/14/15/16/17 Pro Max motherboard mid-frame soldering repair. AMAOE iPhone 12-17 Pro Max motherboard middle layer positioning mold with 0.12mm tin planting mesh net.
Option:
1. 0.12mm middle layer steel mesh for iPhone 12/13/14/15/16/17 series.
2. Positioning mold with 0.12mm middle layer stencil for iPhone 12/13/14/15/16/17 series.
Note: Note: Not including the magnetic base. If you need a full set of iPhone middle layer reballing platforms, please go to SKU: XZ2233.
Features:
1. For iPhone 12/12mini/12 Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/16e/17/Air/17 Pro/17 Pro Max motherboard middle layer tin planting. Precise positioning, fast tin planting.
2. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.
Original: $1.99
-65%$1.99
$0.70Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Amaoe middle layer reballing stencil with positioning mold for iPhone 12/13/14/15/16/17 Pro Max motherboard mid-frame soldering repair. AMAOE iPhone 12-17 Pro Max motherboard middle layer positioning mold with 0.12mm tin planting mesh net.
Option:
1. 0.12mm middle layer steel mesh for iPhone 12/13/14/15/16/17 series.
2. Positioning mold with 0.12mm middle layer stencil for iPhone 12/13/14/15/16/17 series.
Note: Note: Not including the magnetic base. If you need a full set of iPhone middle layer reballing platforms, please go to SKU: XZ2233.
Features:
1. For iPhone 12/12mini/12 Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/16e/17/Air/17 Pro/17 Pro Max motherboard middle layer tin planting. Precise positioning, fast tin planting.
2. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.
