YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip
YCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high-temperature resistance. It ensures precise mesh alignment and long-term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6-17 Pro Max and Android Phone series.
Features:
1. High Precision: Each mesh is calibrated according to the original manufacturer's drawings, ensuring precise placement of each solder ball.
2. Superior Flexibility: Maintains the flexibility of the steel, resisting deformation under high temperatures and easily returning to its original shape.
3. High Temperature and Wear Resistance: Made of imported alloy steel, it can withstand temperatures up to 500ā and is wear-resistant, allowing the stencil to maintain precision even after multiple uses.
4. Perfect Rounded Corner Design: The rounded corner design of the mesh ensures that each solder ball is uniform and full, meeting the soldering requirements of various chips.
5. Dynamic Updates: Continuously updated with new models to meet the latest chip soldering requirements of Apple and Android phones.
Product Parameters
Brand: YCS
Name: YCS Chip Repair StencilĀ
Type 1: Apple Mesh Series
Type 2: Android Mesh Series
Color: Natural Metal
Operating Temperature: -50ā~500ā
Product Information
Product Information
Shipping & Returns
Shipping & Returns
YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip
YCS Mobile BGA Reballing Stencils for iPhone Android Phones CPU Chip
YCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high-temperature resistance. It ensures precise mesh alignment and long-term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6-17 Pro Max and Android Phone series.
Features:
1. High Precision: Each mesh is calibrated according to the original manufacturer's drawings, ensuring precise placement of each solder ball.
2. Superior Flexibility: Maintains the flexibility of the steel, resisting deformation under high temperatures and easily returning to its original shape.
3. High Temperature and Wear Resistance: Made of imported alloy steel, it can withstand temperatures up to 500ā and is wear-resistant, allowing the stencil to maintain precision even after multiple uses.
4. Perfect Rounded Corner Design: The rounded corner design of the mesh ensures that each solder ball is uniform and full, meeting the soldering requirements of various chips.
5. Dynamic Updates: Continuously updated with new models to meet the latest chip soldering requirements of Apple and Android phones.
Product Parameters
Brand: YCS
Name: YCS Chip Repair StencilĀ
Type 1: Apple Mesh Series
Type 2: Android Mesh Series
Color: Natural Metal
Operating Temperature: -50ā~500ā
Original: $1.19
-65%$1.19
$0.42Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
YCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high-temperature resistance. It ensures precise mesh alignment and long-term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6-17 Pro Max and Android Phone series.
Features:
1. High Precision: Each mesh is calibrated according to the original manufacturer's drawings, ensuring precise placement of each solder ball.
2. Superior Flexibility: Maintains the flexibility of the steel, resisting deformation under high temperatures and easily returning to its original shape.
3. High Temperature and Wear Resistance: Made of imported alloy steel, it can withstand temperatures up to 500ā and is wear-resistant, allowing the stencil to maintain precision even after multiple uses.
4. Perfect Rounded Corner Design: The rounded corner design of the mesh ensures that each solder ball is uniform and full, meeting the soldering requirements of various chips.
5. Dynamic Updates: Continuously updated with new models to meet the latest chip soldering requirements of Apple and Android phones.
Product Parameters
Brand: YCS
Name: YCS Chip Repair StencilĀ
Type 1: Apple Mesh Series
Type 2: Android Mesh Series
Color: Natural Metal
Operating Temperature: -50ā~500ā
