YCS Integrated BGA Reballing Stencil kit for iPad 2/3/4/5/6, iPad mini 1/2/3/4, iPad Pro, iPad Air, iPad A9/A10X/A12/A12X, etc. YCS iPad series BGA stencils steel mesh are used for soldering and repairing baseband, CPU, Nand flash, and power chips on iPad motherboards.

Supported models (7pcs/set):
YCS iPad Stencil 01: Compatible with iPad 2 / iPad 3 / iPad 4 / iPad Mini 1.
YCS iPad Stencil 02: Compatible with iPad Mini 2 / iPad Mini 3 / iPad 5 (iPad 2017).
YCS iPad Stencil 03: Compatible with iPad Mini 4 / iPad 6 (iPad 2018).
YCS iPad Stencil 04: Compatible with iPad Pro (Universal Series).
YCS iPad Stencil 05: Compatible with iPad Air 2020 (iPad Air 4).
YCS iPad Stencil 06: Compatible with iPad models featuring A9 / A10X CPU.
YCS iPad Stencil 07: Compatible with iPad models featuring A12 / A12X CPU.

Features:
1. No-Solder Function Test: When paired with a specific fixture, this set enables "solder-free" testing of core functions—including power-on, display, touch sensitivity, camera, Wi-Fi, and Face ID—without the need for soldering.
2. Spring-Loaded Clasp Design: Features a quick-releasing mechanism that provides immediate pressure feedback, ensuring the motherboard remains perfectly flat during testing or reballing procedures for more accurate results.
3. High-Precision Stencil: Crafted from premium stainless steel with laser-cut apertures featuring smooth, clean edges; effectively prevents solder bridging and ensures uniform solder ball formation during the reballing process.
4. Power-On Contact Extension: Eliminates the need to use tweezers for short-circuiting; allows for easy device power-up via dedicated contact points, thereby protecting the motherboard's components.
5. High-Temperature Resistance & Anti-Deformation: Exhibits excellent heat resistance, remaining free from bulging or deformation even after prolonged exposure to hot air during soldering operations.