YCS 2S Chip Heating Platform for mobile phone/iPhone IC glue removal. MaAnt SL-2 CPU Chip Glue Heating Removal Station for Phone IC Chips Heating Degumming. YCS 2S CPU chip glue heating removal platform for iPhone repair. YCS mobile phone repair tool. Efficient preheating, a versatile soldering platform, and safe, efficient chip debonding.

Option:
1. YCS 2S CPU chip glue heating removal platform - it's been discontinued.
2. MaAnt SL-2 CPU Chip Glue Heating Removal Station.

Features:
1. Efficient Preheating: Optimizes soldering results and accelerates BGA reballing and glue removal.
2. Versatile Platform: Suitable for a variety of soldering tasks, especially suitable for mobile phone repair and IC chip manipulation.
3. Precise Temperature Control: Provides targeted temperature adjustment for safer and more efficient heating and glue removal.
4. Durable and Portable: Its sturdy construction and compact size make it easy to carry and store.
5. Easy Operation: Its user-friendly design lowers the barrier to entry and improves work efficiency.
6. Its compact and durable design makes it suitable for a variety of repair scenarios, including removing glue from mobile phone motherboard IC chips, preheating BGA chip reballing, and desoldering and repairing various electronic components.