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RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC

RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC

Amaoe RF1 RF2 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh.

Features

1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh

Advantage:

1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material

Product Information

Shipping & Returns

Product image 1

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RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC

RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC

Amaoe RF1 RF2 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh.

Features

1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh

Advantage:

1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material

Select option

From $0.89

Original: $2.55

-65%

RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC—

$2.55

$0.89

Product Information

Shipping & Returns

Description

Amaoe RF1 RF2 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh.

Features

1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh

Advantage:

1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material

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