Qianli Hot Stone Glue Removal Thermostatic Preheating Station
Qianli MEGA-IDEA Hot Stone preheating platform is used for removing IC glue, such as CPU, Nand flash, ect.Ā Ā
PPD Thermostatic Preheating Station is used for Degumming & removing IC glue, such as CPU, Nand flash, ect.
No air gun heating, No soldering iron heating,No absorbing tin strip, low voltageheating plate, curve heating, all fit design
IC Size: 20mm*18.5mm
Product Features :Ā
- Material: synthetic stone / silica gel / pure copper
- Temperature: 220 ā - 240 ā
- Voltage: AC100-250V
- Copper heating core, ensure heating efficiency; synthetic insulation bottom case.
- Available CPU models: A10, A11, A12, A13
- Available Nand flash models: iPhone 7,7P,8,8P,X,XS,XS MAX,11,11 Pro, 11 Pro MAX.
- Available fingerprint cable: iPhone 7, 7P, 8, 8P.
- Other tiny chips.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Qianli Hot Stone Glue Removal Thermostatic Preheating Station
Qianli Hot Stone Glue Removal Thermostatic Preheating Station
Qianli MEGA-IDEA Hot Stone preheating platform is used for removing IC glue, such as CPU, Nand flash, ect.Ā Ā
PPD Thermostatic Preheating Station is used for Degumming & removing IC glue, such as CPU, Nand flash, ect.
No air gun heating, No soldering iron heating,No absorbing tin strip, low voltageheating plate, curve heating, all fit design
IC Size: 20mm*18.5mm
Product Features :Ā
- Material: synthetic stone / silica gel / pure copper
- Temperature: 220 ā - 240 ā
- Voltage: AC100-250V
- Copper heating core, ensure heating efficiency; synthetic insulation bottom case.
- Available CPU models: A10, A11, A12, A13
- Available Nand flash models: iPhone 7,7P,8,8P,X,XS,XS MAX,11,11 Pro, 11 Pro MAX.
- Available fingerprint cable: iPhone 7, 7P, 8, 8P.
- Other tiny chips.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Qianli MEGA-IDEA Hot Stone preheating platform is used for removing IC glue, such as CPU, Nand flash, ect.Ā Ā
PPD Thermostatic Preheating Station is used for Degumming & removing IC glue, such as CPU, Nand flash, ect.
No air gun heating, No soldering iron heating,No absorbing tin strip, low voltageheating plate, curve heating, all fit design
IC Size: 20mm*18.5mm
Product Features :Ā
- Material: synthetic stone / silica gel / pure copper
- Temperature: 220 ā - 240 ā
- Voltage: AC100-250V
- Copper heating core, ensure heating efficiency; synthetic insulation bottom case.
- Available CPU models: A10, A11, A12, A13
- Available Nand flash models: iPhone 7,7P,8,8P,X,XS,XS MAX,11,11 Pro, 11 Pro MAX.
- Available fingerprint cable: iPhone 7, 7P, 8, 8P.
- Other tiny chips.
