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Qianli 4 in 1 Middle Layer Tin Planting Platform For iPhone 13 Pro Max Mini
Qianli 4 IN 1 middle frame reballing platform for iPhone 13/13 Pro/13 Pro Max/13 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for iPhone 13 series. Qianli iPhone 13 series 4 in 1 double-sided middle layer reballing stencil platform regular/simple version for iPhone 13 motherboard soldering repair. Qianli 4 in 1 motherboard tin planting platform for iPhone 13-13 Pro Max.
Features:
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
Package:
1 x 4 in 1 Middle frame reballing platform
Option:
1. For iPhone 13 series(regular version): two platforms, 4 stencils.
2. For iPhone 13 series(simple version): only one platform, 4 stencils.
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
Package:
1 x 4 in 1 Middle frame reballing platform
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Product Information
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Qianli 4 in 1 Middle Layer Tin Planting Platform For iPhone 13 Pro Max Mini
Qianli 4 in 1 Middle Layer Tin Planting Platform For iPhone 13 Pro Max Mini
Qianli 4 IN 1 middle frame reballing platform for iPhone 13/13 Pro/13 Pro Max/13 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for iPhone 13 series. Qianli iPhone 13 series 4 in 1 double-sided middle layer reballing stencil platform regular/simple version for iPhone 13 motherboard soldering repair. Qianli 4 in 1 motherboard tin planting platform for iPhone 13-13 Pro Max.
Features:
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
Package:
1 x 4 in 1 Middle frame reballing platform
Option:
1. For iPhone 13 series(regular version): two platforms, 4 stencils.
2. For iPhone 13 series(simple version): only one platform, 4 stencils.
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
Package:
1 x 4 in 1 Middle frame reballing platform
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From $5.95
Original: $16.99
-65%Qianli 4 in 1 Middle Layer Tin Planting Platform For iPhone 13 Pro Max Mini—
$16.99
$5.95Product Information
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Description
Qianli 4 IN 1 middle frame reballing platform for iPhone 13/13 Pro/13 Pro Max/13 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for iPhone 13 series. Qianli iPhone 13 series 4 in 1 double-sided middle layer reballing stencil platform regular/simple version for iPhone 13 motherboard soldering repair. Qianli 4 in 1 motherboard tin planting platform for iPhone 13-13 Pro Max.
Features:
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
Package:
1 x 4 in 1 Middle frame reballing platform
Option:
1. For iPhone 13 series(regular version): two platforms, 4 stencils.
2. For iPhone 13 series(simple version): only one platform, 4 stencils.
Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
Package:
1 x 4 in 1 Middle frame reballing platform
