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JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max

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JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max

JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max

JTX SM-01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8-16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement.


Option:
1. SM-01: For iPhone 8/8P/X Qualcomm.
2. SM-02: For iPhone 8/8P/X intel.
3. SM-03: For iPhone XS/XR/XS MAX.
4. SM-04: For iPhone 11/11Pro/11ProMax.
5. SM-05: For iPhone 12/12Pro/12ProMax.
6. SM-06: For iPhone 13/13Pro/13ProMax.
7. SM-07: For iPhone 14/14Plus.
8. SM-08: For iPhone 14Pro/14ProMax/15/15Plus.
9. SM-09: For iPhone 15Pro/15ProMax.
10. SM-10: For iPhone 16/16Plus/16Pro/16ProMax.
11. Super Magnetic Base.
12. For iPhone 8-16 Set:
Magnetic Base: Super Magnetic Universal Base -1PCS.
Swap Board Chips Platform: 8 to 16PM Blue Modules - 10PCS.
Swap Board Chips Stencil: 8 to 16PM Special Stencil - 11PCS.

Features:
1. Product advantages: Super magnetic base, high temperature resistance, precise positioning, unlimited expansion, faster and safer.
2. Strong magnetic base, strong magnetic clamping, automatic alignment.
3. High temperature resistance, high strength, anti-fouling, easy to clean.
4. Selected high-quality steel, wear resistance, high toughness.
5. Square chamfered mesh design, effectively prevents steel mesh bulging/stuck tin balls, and the tin balls are more rounded and full.
6. Environmentally friendly rubber foot pads, with wear resistance, anti-slip, shock absorption, pressure resistance, and anti-aging.

Select Option
From $1.26

Original: $3.59

-65%
JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max—

$3.59

$1.26

Product Information

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Description

JTX SM-01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8-16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement.


Option:
1. SM-01: For iPhone 8/8P/X Qualcomm.
2. SM-02: For iPhone 8/8P/X intel.
3. SM-03: For iPhone XS/XR/XS MAX.
4. SM-04: For iPhone 11/11Pro/11ProMax.
5. SM-05: For iPhone 12/12Pro/12ProMax.
6. SM-06: For iPhone 13/13Pro/13ProMax.
7. SM-07: For iPhone 14/14Plus.
8. SM-08: For iPhone 14Pro/14ProMax/15/15Plus.
9. SM-09: For iPhone 15Pro/15ProMax.
10. SM-10: For iPhone 16/16Plus/16Pro/16ProMax.
11. Super Magnetic Base.
12. For iPhone 8-16 Set:
Magnetic Base: Super Magnetic Universal Base -1PCS.
Swap Board Chips Platform: 8 to 16PM Blue Modules - 10PCS.
Swap Board Chips Stencil: 8 to 16PM Special Stencil - 11PCS.

Features:
1. Product advantages: Super magnetic base, high temperature resistance, precise positioning, unlimited expansion, faster and safer.
2. Strong magnetic base, strong magnetic clamping, automatic alignment.
3. High temperature resistance, high strength, anti-fouling, easy to clean.
4. Selected high-quality steel, wear resistance, high toughness.
5. Square chamfered mesh design, effectively prevents steel mesh bulging/stuck tin balls, and the tin balls are more rounded and full.
6. Environmentally friendly rubber foot pads, with wear resistance, anti-slip, shock absorption, pressure resistance, and anti-aging.