IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble
5Ā in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. ProfessionalĀ repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble
IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble
5Ā in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. ProfessionalĀ repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
Original: $1.09
-65%$1.09
$0.38Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
5Ā in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. ProfessionalĀ repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
