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2uFix Special Bent Blade Set IC Removal Mobile Phone Repair
2uFix Professional Special Blade Kit For Mobile Phone Maintenance Remove Chips Eliminate Adhesive Scrape Bonding Pads Tools (1set 7pcs).
Features:
Alloy steel blade, with nano coating to prevent rust, flexible, light and elastic blade, is not easy to deform and has a longer service life.
The special blade is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
Precision grinding, uniform double-sided trimming, blade from fine to coarse, more uniform force.
Bending design, by bending the blade, realizes and reduces the loss of motherboard, chip, screen, etc., thereby improving the yield.
The thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm.
Package includes:
7 x Blades
Features:
Alloy steel blade, with nano coating to prevent rust, flexible, light and elastic blade, is not easy to deform and has a longer service life.
The special blade is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
Precision grinding, uniform double-sided trimming, blade from fine to coarse, more uniform force.
Bending design, by bending the blade, realizes and reduces the loss of motherboard, chip, screen, etc., thereby improving the yield.
The thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm.
Package includes:
7 x Blades
Product Information
Product Information
Shipping & Returns
Shipping & Returns
2uFix Special Bent Blade Set IC Removal Mobile Phone Repair
2uFix Special Bent Blade Set IC Removal Mobile Phone Repair
2uFix Professional Special Blade Kit For Mobile Phone Maintenance Remove Chips Eliminate Adhesive Scrape Bonding Pads Tools (1set 7pcs).
Features:
Alloy steel blade, with nano coating to prevent rust, flexible, light and elastic blade, is not easy to deform and has a longer service life.
The special blade is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
Precision grinding, uniform double-sided trimming, blade from fine to coarse, more uniform force.
Bending design, by bending the blade, realizes and reduces the loss of motherboard, chip, screen, etc., thereby improving the yield.
The thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm.
Package includes:
7 x Blades
Features:
Alloy steel blade, with nano coating to prevent rust, flexible, light and elastic blade, is not easy to deform and has a longer service life.
The special blade is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
Precision grinding, uniform double-sided trimming, blade from fine to coarse, more uniform force.
Bending design, by bending the blade, realizes and reduces the loss of motherboard, chip, screen, etc., thereby improving the yield.
The thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm.
Package includes:
7 x Blades
$3.15
Original: $8.99
-65%2uFix Special Bent Blade Set IC Removal Mobile Phone Repair—
$8.99
$3.15Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
2uFix Professional Special Blade Kit For Mobile Phone Maintenance Remove Chips Eliminate Adhesive Scrape Bonding Pads Tools (1set 7pcs).
Features:
Alloy steel blade, with nano coating to prevent rust, flexible, light and elastic blade, is not easy to deform and has a longer service life.
The special blade is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
Precision grinding, uniform double-sided trimming, blade from fine to coarse, more uniform force.
Bending design, by bending the blade, realizes and reduces the loss of motherboard, chip, screen, etc., thereby improving the yield.
The thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm.
Package includes:
7 x Blades
Features:
Alloy steel blade, with nano coating to prevent rust, flexible, light and elastic blade, is not easy to deform and has a longer service life.
The special blade is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
Precision grinding, uniform double-sided trimming, blade from fine to coarse, more uniform force.
Bending design, by bending the blade, realizes and reduces the loss of motherboard, chip, screen, etc., thereby improving the yield.
The thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm.
Package includes:
7 x Blades
